Product number: USB31-CFA2-SMD-G

NOTE:

1.Material:

Body(Housing):Thermoplastics,LCP,UL94V-0(Color:Black,Halogen Free).

Upper or Lower Molding Housing:Thermoplastics,LCP,UL94V-0

(Color:Black,Halogen Free).

Back cover:Thermoplastics,LCP,UL94V-0(LCP,Color:Black,Halogen Free).

Contact:Copper Alloy. Outer Shell:Copper Alloy.

Inner Shell:Stainless Stell.

Mid Shell Plated:Stainless Stell.

EMC PAD:Stainless Stell.

2.FINISH

Contact:Au 30u" plated on contact Area

80u" Min.Bright Tin plated on Solder Area

30u" Min.Nickel underplating Over ALL.

Outer Shell:50u Min. Solderability Nickel plated over ALL.

Mid Shell Plated:50u Min. Solderability Nickel plated over ALL

3.Specification

3.1:ELectrical:

Current Rating:5A For Pin(A4,A9,B4,B9),1.25A For Others PIN

Insulation Resistance(EIA-364-21): 100MΩ Min.at 100V/DC

Contact Resistance(EIA-364-06) 50MΩ Max

Dielectric Withstanding Voltage(EIA-364-20)

No discharge,flashover or breakdown at 100V/AC  1Minute

3.2:Mechanical  characteristic:

Insertion Force:5~20N

Extraction Force:0~1000 cycles 8~20N.1000~10000 cycles 5~20N

Durability:10000 cycles

4.Recommended process IR REFLOW:260°C,3-5 Seconds