Specifications:
Material And Finish:
Center Contact:Brass
Outer Contact1(Interface):Brass
Outer Contact2(PCB):Zinc alloy
Dielectric:LCP
Housing:HTN
Plated:
Center Contact:Gold,0.15μm(Interface)
Tin,min.1μm（PCB）
Outer Contact1(Interface):Ni,min.3μm
Outer Contact2(PCB):Tin min.2μm,over nickel
Electrical Data:
Impedance, differential mode:
100 Ω differential signalling, for one pair or quad cable shielded
Frequency :DC to 2 GHz
Return loss : ≥20 dB, DC to ≤ 1 GHz
≥17 dB, > 1 GHz to ≤ 2 GHz
Insertion loss: ≤0.1 dB @ 1 GHz
Skew (between signal contacts) ≤ 25 psec
Nearend-Crosstalk ≤ -30 dB (1 GHz)
Farend-Crosstalk ≤ -35 dB (1 GHz)
Insulation resistance : ≥1x10³ MΩ
Signal contact resistance ≤ 10 mΩ
Outer contact resistance ≤ 7.5 mΩ
Test voltage ：500 V rms
Working voltage： 60 V rms
Power current ≤ 1.5 A DC
RF-leakage (shielding effectiveness) : 75 dB up to 1 GHz (IEC 62153-4-7)
：65 dB up to 2 GHz (IEC 62153-4-7)
Mechanical data:
Mating cycles ≥ 25
Engagement force ≤ 30 N
Disengagement force ≥ 5 N
Retention force latch ≥ 110 N
Coding efficiency ≥ 80 N
Weight 7.7 g
Environmental data:
Temperature range: -40°C to +105°C
Thermal shock: IEC 60068-2-14 Test Na
Temperature and humidity: USCar 2, Rev. 4, 5.6.2
Vibration (Random): IEC 60068-2-64 (class 2)
Mechanical Shock: IEC 60068-2-27
High-Temp. Exposure: IEC 60068-2-2 (temperature +105°C)
Soldering profile: acc. to IEC 60068-2-58; Group 3 (250°C / 30s)
RoHS: compliant
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